|
Type
|
Fast Prototype
|
Volume Production
|
|
Scope
|
Double Side, Multilayers(4-20)
|
Multilayers(4-28), HDI(4-20)Flex, Rigid Flex
|
|
Double Side
|
CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 12mil–126mil (0.3mm-3.2mm)
|
CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil–126mil (0.1mm-3.2mm)
|
|
Multilayers
|
4-20 layers, board thickness 15mil-126mil （0.38mm-3.2mm）
|
4-28 layers, board thickness 8mil-126mil （0.2mm-3.2mm）
|
|
Buried/Blind Via
|
4-18 layers, board thickness 15mil-126mil（0.38mm-3.2mm）
|
4-20 layers, board thickness 10mil-126mil（0.25mm-3.2mm）
|
|
HDI
|
/
|
1+N+1, 2+N+2, 3+N+3, Anylayer
|
|
Flex & Rigid-Flex PCB
|
/
|
1-8layers Flex PCB, 2-12layers Rigid-flex PCB HDI+Rigid-flex PCB
|
|
Laminate
|
Shengyi, EMC, ITEQ, Panasionic, Hitachi....
|
|
Soldermask Type(LPI)
|
Taiyo, Goo’s, Probimer.....
|
Taiyo, Goo’s, Probimer FPC.....
|
|
Peelable Soldermask
|
Peters
|
|
Carbon ink
|
Nipon
|
|
HASL/Lead Free HASL
|
Thickness: 0.5-40um
|
Thickness: 0.5-40um
|
|
OSP
|
Entek Plus HT, Preflux F2 LX
|
|
ENIG (Ni-Au)
|
Au:0.03um≤max＜0.06um Ni:3um≤max≤6um
|
|
Electro-bondable Ni-Au
|
Au:0.2-1.0um Ni:2.54-10um
|
|
Electro-nickel palladium Ni-Au
|
|
Au: 0.015-0.075um Pd 0.02-0.075um Ni:2-6umm
|
|
Electro. Hard Gold
|
Au:5~50uin(0.125~1.27um); Nithickness:100~250uin(2.50~6.25um)
|
|
Thick tin
|
1.0-1.4um
|
|
Capability
|
Mass Production
|
Mass Production
|
|
Min Mechanical Drill Hole
|
0.20mm
|
0.20mm
|
|
Min. Laser Drill Hole
|
/
|
4mil (0.100mm)
|
|
Line Width/Spacing
|
3mil/3mil
|
2mil/2mil
|
|
Max. Panel Size
|
18.5" X 24.5"(470mm X 622mm)
|
21.5" X 24.5"(546mm X 622mm)
|
|
Line Width/Spacing Tolerance
|
+/-10% ~ +/-20%
|
Non electro coating:+/-5um，Electro coating:+/-10um
|
|
PTH Hole Tolerance
|
+/-0.003inch(0.075mm)
|
+/-0.002inch(0.050mm)
|
|
NPTH Hole Tolerance
|
+/-0.002inch(0.050mm)
|
+/-0.002inch(0.050mm)
|
|
Hole Location Tolerance
|
+/-0.003inch(0.075mm)
|
+/-0.002inch(0.050mm)
|
|
Hole to Edge Tolerance
|
+/-0.004inch(0.100mm)
|
+/-0.004inch(0.100mm)
|
|
Edge to Edge Tolerance
|
+/-0.004inch(0.100mm)
|
+/-0.004inch(0.100mm)
|
|
Layer to Layer Tolerance
|
+/-0.004inch(0.100mm)
|
+/-0.003inch(0.075mm)
|
|
Impedance Tolerance
|
+/- 10%
|
+/- 10%
|
|
Warpage %
|
Max ≤0.75%
|
Max≤0.5%
|
|
Technology (HDI Product)
|
|
ITEM
|
Production
|
Tighten Control
|
|
Laser Via Drill/Pad
|
0.125/0.30, 0.125/0.38
|
0.125/0.28, 0.125/0.36, 0.20/0.40
|
|
Blind Via Drill/Pad
|
0.25/0.50
|
0.20/0.45
|
|
Line Width/Spacing
|
0.10/0.10
|
0.075/0.075
|
|
Hole Formation
|
CO2 Laser Direct Drill
|
|
|
Build Up Material
|
FR4 LDP(LDD); RCC 50 ~100 micron
|
|
|
Cu Thickness on Hole Wall
|
Blind Hole: 10um(min)
|
Buried Hole: 13um(min)
|
|
Aspect Ratio
|
0.8 : 1
|
|
|
Technology (Flexible PCB)
|
|
Project
|
Ability
|
|
Roll to roll (one side)
|
YES
|
|
Roll to roll (double)
|
NO
|
|
Volume to roll material width mm
|
250
|
|
Minimum production size mm
|
250x250
|
|
Maximum production size mm
|
500x500
|
|
SMT Assembly patch (Yes/No)
|
YES
|
|
Air Gap capability (Yes/No)
|
YES
|
|
Production of hard and soft binding plate(Yes/No)
|
YES
|
|
Max layers(Hard)
|
10
|
|
Tallest layer(Soft plate)
|
6
|
|
Material Science
|
|
|
PI
|
YES
|
|
PET
|
YES
|
|
Electrolytic copper
|
YES
|
|
Rolled Anneal Copper Foil
|
YES
|
|
PI
|
|
|
Covering film alignment tolerance mm
|
±0.1
|
|
Minimum covering film mm
|
0.175
|
|
Reinforcement
|
|
|
PI
|
YES
|
|
FR-4
|
YES
|
|
SUS
|
YES
|
|
EMI SHIELDING
|
|
|
Silver Ink
|
YES
|
|
Silver Film
|
YES
|
